Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test Liu, Shenyi ; Vuorinen, Vesa ; Liu, Xing ; Fredrikson, Olli ; Brand, Sebastian ; Tiwary, Nikhilendu ; Lutz, Josef ; Paulasto-Kröckel, Mervi Abstract Publication: IEEE Transactions on Power Electronics Pub Date: December 2024 DOI: 10.1109/TPEL.2024.3447909 Bibcode: 2024ITPE...3916695L