Thermal and IR Drop Analysis Using Convolutional Encoder-Decoder Networks
Abstract
Computationally expensive temperature and power grid analyses are required during the design cycle to guide IC design. This paper employs encoder-decoder based generative (EDGe) networks to map these analyses to fast and accurate image-to-image and sequence-to-sequence translation tasks. The network takes a power map as input and outputs the corresponding temperature or IR drop map. We propose two networks: (i) ThermEDGe: a static and dynamic full-chip temperature estimator and (ii) IREDGe: a full-chip static IR drop predictor based on input power, power grid distribution, and power pad distribution patterns. The models are design-independent and must be trained just once for a particular technology and packaging solution. ThermEDGe and IREDGe are demonstrated to rapidly predict the on-chip temperature and IR drop contours in milliseconds (in contrast with commercial tools that require several hours or more) and provide an average error of 0.6% and 0.008% respectively.
- Publication:
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arXiv e-prints
- Pub Date:
- September 2020
- DOI:
- 10.48550/arXiv.2009.09009
- arXiv:
- arXiv:2009.09009
- Bibcode:
- 2020arXiv200909009C
- Keywords:
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- Computer Science - Hardware Architecture;
- Computer Science - Artificial Intelligence;
- Computer Science - Machine Learning
- E-Print:
- Accepted in ASP-DAC 2021 conference