Design of Main Circuit for an SiC-MOSFET Inverter Using a Thick Copper Multilayer PCB to Minimize Stray Inductance
Abstract
- Publication:
-
IEEJ Transactions on Industry Applications
- Pub Date:
- February 2020
- DOI:
- 10.1541/ieejias.140.89
- Bibcode:
- 2020IJTIA.140...89I