Development of a via-hole connection process via intense pulsed light sintering with Cu micro/Ag nano-hybrid ink for a multi-layered flexible printed circuit board
Abstract
- Publication:
-
Thin Solid Films
- Pub Date:
- June 2019
- DOI:
- 10.1016/j.tsf.2019.04.015
- Bibcode:
- 2019TSF...680....1C