Simple and Re-useable Flip-Chip Method for Hybrid Quantum Sytems
Abstract
The flexibility and scalability of solid-state qubit systems can be greatly improved with the use of flip-chip geometries, as these provide a third dimension for interconnects and allow coupling of systems on different substrates. Indium bump-bonded flip-chips can be prohibitively costly for a university lab, and do not offer a means to re-use the substrates. Here, we describe a simple, low cost, non-galvanic approach to flip-chip bonding, demonstrated using superconducting qubits coupled to other quantum systems, including acoustic and electromagnetic resonators. We achieve less than two microns of placement error, and provide a cryogenically-compatible bonded structure that can be disassembled using acetone. We have tested the approach using inductively coupled coplanar waveguide resonators, and we have designed a multi-qubit experiment with direct inductive coupling between qubits on separate substrates.
Supported by AFOSR MURI program, UChicago MRSEC (NSF DMR-1420709), and the ARL. We made use of the Pritzker Nanofabrication Facility, supported by the NSF award NNCI-1542205.- Publication:
-
APS March Meeting Abstracts
- Pub Date:
- 2019
- Bibcode:
- 2019APS..MARL11010C