A new way of measuring wiggling pattern in SADP for 3D NAND technology
Abstract
A new metrology method of quantitatively measuring wiggling patterns in a Self-Aligned Double Patterning (SADP) process for 2D NAND technology has been developed with a CD-SEM metrology program on images from a Review-SEM system. The metrology program provided accurate modeling of various wiggling patterns. The Review-SEM system provided a-few-micrometer-wide Field of View (FOV), which exceeds precision-guaranteed FOV of a conventional CD-SEM. The result has been effectively verified by visual inspection on vertically compressed images compared with Wiggling Index from this new method. A best-known method (BKM) system has been developed with connected HW and SW to automatically measure wiggling patterns.
- Publication:
-
Metrology, Inspection, and Process Control for Microlithography XXXII
- Pub Date:
- March 2018
- DOI:
- 10.1117/12.2297249
- Bibcode:
- 2018SPIE10585E..2SM