RF and Thermal Considerations of a Flip-Chip Integrated 40+ Gb/s Silicon Photonic Electro-Optic Transmitter - NASA/ADS

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RF and Thermal Considerations of a Flip-Chip Integrated 40+ Gb/s Silicon Photonic Electro-Optic Transmitter

Publication:: Journal of Lightwave Technology
Pub Date:: January 2018
DOI:: 10.1109/JLT.2017.2779757
Bibcode:: 2018JLwT...36..245Y

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