Chip-on-Flex Packaging of Optoelectronic Devices in Polymer-Based Planar Optical Interconnects
Abstract
- Publication:
-
IEEE Journal of Selected Topics in Quantum Electronics
- Pub Date:
- November 2018
- DOI:
- 10.1109/JSTQE.2018.2827674
- Bibcode:
- 2018IJSTQ..2427674W