Thermal Stability of Bi-2223 Wires
Abstract
The review novel approaches are presented to describe quench/heat developments in HTS Bi-2223-based devices. These approaches permit determination of thermal stability level for both: Uniform and non-uniform heating of HTS devices, particularly during overheat conditions. Thermal quench/thermal runaway current and characteristic time of heating development can be evaluated. At non-uniform heating blow-up, regimes with temperature localization could happen that should be taken into account by HTS cables designers. Review of studies of cooling of HTS wires by boiled liquid nitrogen is also presented.
- Publication:
-
Research
- Pub Date:
- 2016
- DOI:
- 10.1142/9789814749268_0008
- Bibcode:
- 2016rfab.book..105V