Stress relaxation and failure behavior of Sn-3.0Ag-0.5Cu flip-chip solder bumps undergoing electromigration
Abstract
- Publication:
-
Journal of Materials Research
- Pub Date:
- November 2014
- DOI:
- 10.1557/jmr.2014.231
- Bibcode:
- 2014JMatR..29.2556H