Cooling Unit for Computer Chip by using Boiling Heat Transfer
Abstract
In recent years, the heating value of CPU has been increasing rapidly in proportion to the improvement of computer performance. Therefore computer industry is requiring the new cooling unit having high cooling performance for CPU adaptable to high heating value and high heat flux. In the past the cooling unit for CPU is used with air-cooling aluminum fin, but it can not be adaptable to high heating value. We have developed a new compact boiling refrigerant type cooling unit for CPU having high cooling performance in comparing with air-cooling aluminum fin. This paper described the cooling performance and pressure drop characteristics of the boiling refrigerant type cooling unit for CPU. The characteristics were clarified by testing the cooling unit under various test conditions, which were different Reynolds number, various sizes of cooling unit and various inclination angles. Furthermore the equations to predict cooling performance and pressure drop which are necessary on design of the cooling unit were proposed.
- Publication:
-
Transactions of the Japan Society of Refrigerating and Air Conditioning Engineers
- Pub Date:
- 2012
- Bibcode:
- 2012TRACE..21..309K
- Keywords:
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- Heat transfer;
- Thermosyphon;
- Boiling;
- Condensation;
- Cooling unit