Thermal stability of thermoelectric materials via in situ resistivity measurements
Abstract
An experimental setup for determining the electrical resistivity of several types of thermoelectric materials over the temperature range 20 < T < 550 °C is described in detail. One resistivity measurement during temperature cycling is performed and explained for Cu0.01Bi2Te2.7Se0.3 and a second measurement is made on Yb0.35Co4Sb12 as a function of time at 400 °C. Both measurements confirm that the materials are thermally stable for the temperature range and time period measured. Measurements made during temperature cycling show an irreversible decrease in the electrical resistivity of Cu0.01Bi2Te2.7Se0.3 when the measuring temperature exceeds the maximum sample fabrication temperature. Several other possible uses of such a system include but are not limited to studying the effects of annealing and/or oxidation as a function of both temperature and time.
- Publication:
-
Review of Scientific Instruments
- Pub Date:
- November 2012
- DOI:
- 10.1063/1.4767904
- arXiv:
- arXiv:1206.2094
- Bibcode:
- 2012RScI...83k5114L
- Keywords:
-
- annealing;
- bismuth compounds;
- cobalt compounds;
- copper compounds;
- electric variables measurement;
- electrical resistivity;
- oxidation;
- Seebeck effect;
- tellurium compounds;
- thermal stability;
- ytterbium compounds;
- 84.37.+q;
- 72.20.Pa;
- 81.40.Gh;
- Measurements in electric variables;
- Thermoelectric and thermomagnetic effects;
- Other heat and thermomechanical treatments;
- Condensed Matter - Materials Science
- E-Print:
- doi:10.1063/1.4767904