Spatial Fourier Transform Analysis of Polishing Pad Surface Topography
Abstract
The spatial Fourier transform analysis is proposed to quantitatively evaluate the irregular topography of the conditioned chemical mechanical polishing (CMP) pad surface. We discuss the power spectrum in the spatial wavelengths of the surface topographies corresponding to polishing time. We conclude that the spatial wavelength of less than 5 µm in the topography yielded high material removal rates.
- Publication:
-
Japanese Journal of Applied Physics
- Pub Date:
- May 2012
- DOI:
- 10.1143/JJAP.51.05EF04
- Bibcode:
- 2012JaJAP..51eEF04K