Suppressing the growth of interfacial Cu-Sn intermetallic compounds in the Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joint during thermal aging
Abstract
- Publication:
-
Journal of Materials Science
- Pub Date:
- May 2012
- DOI:
- 10.1007/s10853-012-6254-0
- Bibcode:
- 2012JMatS..47.4012C