Through-Silicon Via Fill for 3D Interconnect Applications Mathew, Varughese ; Chatterjee, Ritwik ; Jones, Robert ; Garcia, Sam ; Acosta, Eddie ; Huang, Zhihong Abstract Publication: ECS Transactions Pub Date: March 2009 DOI: 10.1149/1.3115648 Bibcode: 2009ECSTr..16v..33M