Three-dimensional memory module for space application
Abstract
NASDA is developing a new high-speed, onboard microcomputer for space applications, such as micro satellites and space robots, which require high-performance MPUs and high-speed, high-volume memory systems. We selected the TZ-CSP (Fig. 1 Tape z-Axis chip-scale package) technology, a three-dimensional (3-D) assembly technology, to build a high-speed, high-performance memory system. This study investigated the long-term reliability and temperature characteristics of TZ-CSP diodes and resistors to examine their applicability to space systems. We conducted basic thermal cycle tests and moisture resistance tests and shock, vibration, and thermal shock tests on TZ-CSP samples in conformity with MIL-STD-202.
- Publication:
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European Space Components Conference, ESCCON 2002
- Pub Date:
- December 2002
- Bibcode:
- 2002ESASP.507..227Y