Ablation Plasma Ion Implantation Optimization and Deposition of Compound Coatings
Abstract
Ablation Plasma Ion Implantation (APII) utilizes KrF laser ablation plasma plumes to implant ions into pulsed, negatively-biased substrates [1]. Ablation targets are Ti foils and TiN disks. Substrates are Si wafers and Al, biased from 0 to -10 kV. Optimization experiments address: 1) configurations that reduce arcing, 2) reduction of particulate, and 3) deposition/implantation of compounds (e.g. TiN). Arcing is suppressed by positioning the target perpendicular (previously parallel) to the substrate. Thus, bias voltage can be applied at the same time as the KrF laser, resulting in higher ion current. This geometry also yields lower particulate. APII with TiN has the goal of hardened coatings with excellent adhesion. SEM, AFM, XPS, TEM, and scratch tests characterize properties of the thin films. Ti APII films at - 4kV are smoother with lower friction. 1. B. Qi, R.M. Gilgenbach, Y.Y. Lau, M.D. Johnston, J. Lian, L.M. Wang, G. L. Doll and A. Lazarides, APL, 78, 3785 (2001) * Research funded by NSF
- Publication:
-
APS Annual Gaseous Electronics Meeting Abstracts
- Pub Date:
- October 2002
- Bibcode:
- 2002APS..GECGTP015J