A New Remote Plasma Source for HDP-CVD Process Chamber Dry-Cleaning
Abstract
A new class of remote plasma sources has been developed for use in the semiconductor industry for process chamber cleaning. These sources employ no capacitive coupling in their plasma generation and are appropriate for use with fluorine-based chamber dry cleaning recipes. This property, combined with low cost make them superior to microwave sources currently in use in the industry. Fundamental principles of the design of one such source jointly developed by Applied Materials and Advanced Energy, as well as process results in an Applied Materials HDP-CVD reactor will be discussed. Performance of the unit will be shown, including reduction in the use of NF3 for chamber cleaning purposes.
- Publication:
-
APS Annual Gaseous Electronics Meeting Abstracts
- Pub Date:
- October 2000
- Bibcode:
- 2000APS..GECDT2006C