Imidization and Interfacial Properties of Polyimides
Abstract
Polyimides have found wide use as interlevel dielectrics for multilevel interconnections and electronic packaging. One of the major disadvantages of polyimides is the high degree of dielectric anisotropy due to chain alignment near the substrate. Computer simulations are used to examine the imidization and interfacial behavior of polyimides. Quantum mechanics were used to investigate the imidization reaction which converts polyamic acids into polyimides. These results allowed the incorporation of the chemical reaction of imidization into classical calculations. Specifically, molecular dynamics simulations have been carried out to obtain a picture of the imidization process and resulting polyimide packing near the substrate. These results lay the foundation for further investigations of polyimide/silica interactions which may affect both the degree of imidization and chain orientation at the interface.
- Publication:
-
APS March Meeting Abstracts
- Pub Date:
- March 1998
- Bibcode:
- 1998APS..MAR.Q3806Y