Ionized PVD with an Inductively Coupled Plasma Source
Abstract
Ionized physical vapor deposition (iPVD) is used to enhance the directionality of metal deposition. This is a potential solution to depositing into higher aspect-ratio trenches and vias for metal interconnects. A dc magnetron (Donated by Materials Research Corporation) is coupled with an inductively coupled plasma (ICP) coil to increase the ionization of the sputtered metal atoms. This allows metal ions to be accelerated across the plasma sheath to a biased substrate and deposited normally. One coil design has a wider diameter than the substrate to reduce shadowing and flaking effects. Argon and neon working gases and aluminum and copper targets are investigated at varying pressures and power levels. Deposition rates and metal flux ionization fractions are measured with a quartz crystal microbalance and a multi-grid analyzer.
- Publication:
-
APS Annual Gaseous Electronics Meeting Abstracts
- Pub Date:
- October 1997
- Bibcode:
- 1997APS..GECOWP225H