Failure mechanisms in {AlGaAs}/{GaAs} HEMTs
Abstract
Failure mechanisms in {AlGaAs}/{GaAs} high electron mobility transistors (HEMTs) life tested under high temperature storage, high temperature with d.c. bias, and high temperature with d.c. bias under r.f. drive have been determined to differ significantly. Monte Carlo modeling has been used to explain the experimental data, which shows evidence of gate sinking, ohmic contact degradation, and trapped charge formation near the two-dimensional gas (2DEG). Of particular interest is the evidence of damage from hot carriers under the stress conditions of high temperature with d.c. bias under r.f. drive, which most closely simulates actual use conditions.
- Publication:
-
Solid State Electronics
- Pub Date:
- September 1995
- DOI:
- 10.1016/0038-1101(95)00058-2
- Bibcode:
- 1995SSEle..38.1623C