Packaging Technology for High-Speed Multichip Modules with a Copper-Polyimide Thin-Film Multilayer Substrate Yamaguchi, Satoru ; Tomimuro, Hisashi ; Ohno, Yukiharu ; Hino, Shigeki Abstract Publication: Multichip Modules Pub Date: 1995 Bibcode: 1995SPIE.2575..472Y