Microchannel heat pipe cooling of modules
Abstract
The purpose of this presentation is the proposal of a novel, highly sophisticated cooling technique with a promising performance, but with a very early status of development - the microchannel heat pipe cooling. This technique can be directly adapted to the basic idea of Modular Avionics resulting on the hardware side in a modular packaging design with interchangeable modules. Due to the early status of the development and of the basic research some of the very stringent requirements for military airborne equipment are not met yet (or information is missing) like the impact of acceleration and orientation; nevertheless, the normal performance capability is highly compliant with the dramatically increasing local maximum heat densities and total maximum heat dissipations, which are forecast for future avionic applications. The presentation shall highlight the status of the development and the benefits of this technique; the latter is done by a comparison to the well established cooling methods for the module like Liquid Flow Through (LFT) and conduction cooling, in order to provide a clear impression of the cooling capabilities. Especially if the microchannel heat pipe is combined with a micro heat exchanger for the heat transfer off the module, the performance with respect to the maximum local heat density, the most challenging requirement for the future, is high in excess of the LFT method.
- Publication:
-
In AGARD
- Pub Date:
- October 1994
- Bibcode:
- 1994apcd.agar.....M
- Keywords:
-
- Heat Exchangers;
- Heat Pipes;
- Heat Transfer;
- Liquid Cooling;
- Microchannels;
- Airborne Equipment;
- Aircraft Equipment;
- Avionics;
- Liquid Flow;
- Modules;
- Fluid Mechanics and Heat Transfer