Plastic encapsulated parts
Abstract
Plastic semiconductor packages were characterized as possible alternatives for canned devices, which are susceptible to internal shorts caused by conductive particles. Highly accelerated stress testing (HAST) as well as electrical and mechanical testing were conducted on plastic technology devices.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- October 1994
- Bibcode:
- 1994STIN...9521729C
- Keywords:
-
- Accelerated Life Tests;
- Field Effect Transistors;
- N-P-N Junctions;
- Plastics;
- Semiconductor Devices;
- Semiconductors (Materials);
- Electrical Properties;
- Load Tests;
- Mechanical Properties;
- Stress Analysis;
- Electronics and Electrical Engineering