Characterization of adhesion in thin-film materials by the blister test
Abstract
In this work a blister test is applied to study the adhesion of thin films to substrates. In the blister test one injects at constant rate at the interface between the substrates and an overlayer to create a `blister.' The fluid pressure is measured as function of time. An analysis gives a reliable way of calculating the adhesion energy G(sub a) from the time-dependent pressure data. The method was applied to a variety of systems including polymer/polymer, polymer/silicon, and polymer/metal interfaces. The results show that the test is very sensitive and is able to determine small adhesion energies inaccessible in conventional peel tests. This work demonstrates that the blister test provides a means of relating the mechanical strength of an interface to its microscopic dynamic and structural features
- Publication:
-
NASA STI/Recon Technical Report A
- Pub Date:
- 1992
- Bibcode:
- 1992STIA...9580006C
- Keywords:
-
- Adhesion;
- Debonding (Materials);
- Interfacial Tension;
- Liquid-Solid Interfaces;
- Rupturing;
- Substrates;
- Thin Films;
- Failure Analysis;
- Fluid Pressure;
- Photoelectron Spectroscopy;
- Pressure Effects;
- Time Dependence;
- Solid-State Physics