Multichip module enablers for high reliability applications
Abstract
Multichip modules (MCM's) intended for decades of highly reliable operation require more than the manufacturer's assurance based on one product-specific qualification test. There are few MCM production and field track records on which to base such confidence. To gain uniform, rigorous MCM qualification for high reliability applications, Sandia has developed a set of assembly test chips which are available for manufacturers and users to evaluate, characterize, and compare the particular MCM technology in terms of materials, chemical aging, geometries, stress state, thermal management, and assembly techniques.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- December 1991
- Bibcode:
- 1991STIN...9224566C
- Keywords:
-
- Aging (Materials);
- Chips (Electronics);
- Circuit Reliability;
- Electronic Modules;
- Integrated Circuits;
- Mechanical Properties;
- Microelectronics;
- Performance Tests;
- Reliability Engineering;
- Aluminum;
- Copper;
- Corrosion;
- Silicon;
- Silicon Oxides;
- Standards;
- Substrates;
- Electronics and Electrical Engineering