Thermal analysis report of the SANDAC V processor module
Abstract
The case and junction temperatures of selected integrated circuits (ICs) on the processor module of the SANDAC V computer were calculated using BETAsoft-R, a personal computer, thermal analysis software program. The predicted data was then compared to corresponding IC case temperature measurements from laboratory tests of a functional SANDAC V computer. Although the difference between the actual and calculated values was somewhat higher than expected, the results of the analysis indicate that BETAsoft-R identified the critical ICs on the processor module and that it is capable of analyzing printed circuit boards for potential thermal problems before the design layout is finalized.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- August 1991
- Bibcode:
- 1991STIN...9212191N
- Keywords:
-
- Computerized Simulation;
- Integrated Circuits;
- Temperature Measurement;
- Thermal Analysis;
- Thermocouples;
- Computation;
- Computer Programs;
- Computers;
- Electronics and Electrical Engineering