Assembly and packaging of microwave gallium arsenide devices for the space environment
Abstract
Work carried out investigating the placement, wire bonding and packaging of gallium arsenide devices for space applications is described. Selection of adhesives for die placement and lid sealing and comparison with a gold/tin eutectic for the same process are described. An investigation of thermosonic gold wire wedge bonding is presented. Identification of a ceramic microwave package is performed. Stress testing intended to be carried out on specially selected test pieces is discussed.
- Publication:
-
ESA Special Publication
- Pub Date:
- March 1991
- Bibcode:
- 1991ESASP.313..209W
- Keywords:
-
- Assembling;
- Electronic Equipment Tests;
- Electronic Packaging;
- Eutectic Alloys;
- Gallium Arsenides;
- Gold Alloys;
- Sealing;
- Space Environment Simulation;
- Tin Alloys;
- Adhesives;
- Stress Analysis;
- Ultrasonic Soldering;
- Wiring;
- Electronics and Electrical Engineering