Cooling of a multichip electronic module by means of confined two-dimensional jets of dielectric liquid
Abstract
Experiments were performed to investigate single-phase heat transfer from a smooth 12.7 x 12.7-sq-mm simulated chip to a two-dimensional jet of dielectric FC-72 liquid issuing from a thin rectangular slot into a channel confined between the chip surface and nozzle plate. The effects of jet width, confinement channel height, and impingement velocity have been examined. Channel height had a negligible effect on the heat-transfer performance of the jet. A correlation for the convective heat-transfer coefficient is presented as a function of jet width, heater length, flow velocity, and fluid properties. A self-contained multichip cooling module consisting of a 3 x 3 array of heat sources confirmed the uniformity and predictability of cooling for each of the nine chips, and proved the cooling module is well suited for packaging large arrays of high-power-density chips.
- Publication:
-
ASME Journal of Heat Transfer
- Pub Date:
- November 1990
- Bibcode:
- 1990ATJHT.112..891W
- Keywords:
-
- Chips (Electronics);
- Dielectrics;
- Electronic Modules;
- Heat Transfer Coefficients;
- Liquid Cooling;
- Two Dimensional Jets;
- Confining;
- Performance Tests;
- Solid Surfaces;
- Fluid Mechanics and Heat Transfer