Polyimide planarization in integrated circuits
Abstract
One of the properties which make polyimides (PI) attractive as inter-level insulators in integrated circuits is related to their ability to planarize topographical features. The present investigation is concerned with the role of many of the factors which affect planarization. Attention is given to the effects of the drying process on planarization, the degree of planarization (DOP) obtained with fully cured films, measurements of the maximum slope of the cured PI film, and improvements of the DOP obtained by making use of multiple layers.
- Publication:
-
IN: Polyimides: Synthesis
- Pub Date:
- 1984
- Bibcode:
- 1984psca....2..767D
- Keywords:
-
- Integrated Circuits;
- Planar Structures;
- Polyimides;
- Polymer Chemistry;
- Polymeric Films;
- Surface Properties;
- Film Thickness;
- Mathematical Models;
- Molecular Weight;
- Multilayer Insulation;
- Solid Solutions;
- Electronics and Electrical Engineering