Modular avionics packaging standardization
Abstract
The Modular Avionics Packaging (MAP) Program for packaging future military avionics systems with the objective of improving reliability, maintainability, and supportability, and reducing equipment life cycle costs is addressed. The basic MAP packaging concepts called the Standard Avionics Module, the Standard Enclosure, and the Integrated Rack are summarized, and the benefits of modular avionics packaging, including low risk design, technology independence with common functions, improved maintainability and life cycle costs are discussed. Progress made in MAP is briefly reviewed.
- Publication:
-
6th Digital Avionics Systems Conference
- Pub Date:
- 1984
- Bibcode:
- 1984davs.conf..641A
- Keywords:
-
- Avionics;
- Electronic Packaging;
- Modules;
- Aircraft Maintenance;
- Design Analysis;
- Life Cycle Costs;
- Maintainability;
- Military Aircraft;
- Very Large Scale Integration;
- Electronics and Electrical Engineering