Radiation hardened package for integrated electronics
Abstract
The feasibility of radiation hardened packaging for integrated electronics has been studied for earth satellite applications. The results of preliminary package designs indicate that substantial dose reduction in silicon may be achieved with significant weight penalty reduction relative to box and board level shielding.
- Publication:
-
NTC 1983; Proceedings of the National Telesystems Conference
- Pub Date:
- 1983
- Bibcode:
- 1983ntc..conf...73M
- Keywords:
-
- Circuit Reliability;
- Electronic Packaging;
- Integrated Circuits;
- Radiation Hardening;
- Spacecraft Electronic Equipment;
- Spacecraft Shielding;
- Electromagnetic Shielding;
- Radiation Dosage;
- Radiation Shielding;
- Radiation Tolerance;
- Satellite-Borne Instruments;
- Spacecraft Reliability;
- Weight Reduction;
- Electronics and Electrical Engineering