Investigation of fast Schottky contact reliability using plasma etching
Abstract
A systematic investigation on a bipolar logic family was carried out as far as the reliability of the metallization system is concerned by means of thermal step stress. Computer aided equipment was used for the measurements. The samples were plasma-etched to allow observation of the metal-semiconductor interface. The results show good stability of the investigated elements.
- Publication:
-
Reliability and Maintainability
- Pub Date:
- September 1982
- Bibcode:
- 1982rema.rept..553O
- Keywords:
-
- Circuit Reliability;
- Electric Contacts;
- Plasma Etching;
- Reliability Analysis;
- Schottky Diodes;
- Computer Techniques;
- Semiconductor Junctions;
- Service Life;
- Temperature Effects;
- Ttl Integrated Circuits;
- Electronics and Electrical Engineering