High density circuit technology, part 3
Abstract
Dry processing - both etching and deposition - and present/future trends in semiconductor technology are discussed. In addition to a description of the basic apparatus, terminology, advantages, glow discharge phenomena, gas-surface chemistries, and key operational parameters for both dry etching and plasma deposition processes, a comprehensive survey of dry processing equipment (via vendor listing) is also included. The following topics are also discussed: fine-line photolithography, low-temperature processing, packaging for dense VLSI die, the role of integrated optics, and VLSI and technology innovations.
- Publication:
-
Final Report Mississippi State Univ
- Pub Date:
- March 1982
- Bibcode:
- 1982msu..reptS....W
- Keywords:
-
- Etching;
- Semiconductor Devices;
- Vapor Deposition;
- Glow Discharges;
- Integrated Optics;
- Large Scale Integration;
- Photolithography;
- Electronics and Electrical Engineering