Advanced programmer manufacturing
Abstract
Point-to-point wiring in electronic packages was reduced by redesigning the package and using multilayer printed wiring boards. Processes to provide a leak rate of less than 1 x 10 to the -6 power cu cm/s were determined, but a low moisture content of 20 parts per million over the assembly life could not be achieved. Several materials were considered for use as a conformal coating, from which a two-component urethane which could be applied in multiple thin coats was chosen. A three-cycle (dip, spin, and oven-cure) process was developed for application of the material. Raised lands were evaluated, and recommendations to reduce their occurrence are given.
- Publication:
-
Final Report Bendix Corp
- Pub Date:
- August 1982
- Bibcode:
- 1982bend.rept.....E
- Keywords:
-
- Circuit Boards;
- Electronic Packaging;
- Manufacturing;
- Printed Circuits;
- Coating;
- Moisture Resistance;
- Plastic Coatings;
- Stainless Steels;
- Urethanes;
- Wiring;
- Electronics and Electrical Engineering