Resistance measurements by radio telemetric system during film deposition by sputtering
Abstract
The electrical resistivity of metallic thin films depends to a large degree on the film structure. Factors of instability related to structure, microstructure, and material composition can produce changes in the slope of the Sondheimer straight line. Dynamic information on film growth during deposition can be obtained by measuring film resistance as a function of film thickness and analyzing the measured data on the basis of the relations of the Sondheimer straight line. For the application of the considered procedure to the control of the film production process it is necessary to employ a technique which makes it possible to perform resistance measurements during film deposition in a commercial sputtering system operating with a vacuum load lock and a rotating substrate pallet. In this connection, a telemetry system which can be mounted between the two pallets of a double pallet assembly was developed. The results of experiments is discussed, taking into account the film resistance variation during sputtering.
- Publication:
-
Siemens Forschungs und Entwicklungsberichte
- Pub Date:
- 1982
- Bibcode:
- 1982SiFoE..11..322M
- Keywords:
-
- Electrical Measurement;
- Electrical Resistance;
- Radio Telemetry;
- Sputtering;
- Thin Films;
- Vacuum Deposition;
- Data Acquisition;
- Film Thickness;
- Metal Films;
- Microstructure;
- Production Engineering;
- Electronics and Electrical Engineering