Material processing - An overview
Abstract
The current status of laser material processing is reviewed with emphasis on the physical mechanisms and general areas of application. The physical phenomena involved in the interaction of laser energy with absorbing surfaces are examined with reference to relevant processes such as laser heating, penetration, surface vaporization, plasma formation, and shock wave generation. Some of the developing areas of laser processing application, including semiconductor processing, laser annealing, regrowth of silicon, pattern generation, and surface modification, are briefly discussed.
- Publication:
-
IEEE Proceedings
- Pub Date:
- June 1982
- Bibcode:
- 1982IEEEP..70..533R
- Keywords:
-
- Laser Annealing;
- Laser Applications;
- Laser Heating;
- Materials Science;
- Production Engineering;
- Semiconductors (Materials);
- Technology Assessment;
- Crystal Growth;
- Energy Absorption;
- Laser Plasmas;
- Laser Target Interactions;
- Shock Wave Generators;
- Silicon;
- Specular Reflection;
- Surface Reactions;
- Vaporizing;
- Lasers and Masers