Temperature control of electronic components using fluidised beds
Abstract
This paper introduces the concept of fluidized bed cooling applied to electronic systems. It is shown that, when fluidized with air, the cooling efficiency and the pumping power are principally dependent on particle characteristics; in particular the mean diameter should not be less than 100 microns. Design rules are developed and applied to two types of fluid-bed systems: (1) a small bed of alumina particles cooling single devices of 40 W power dissipation where the fluidizing air is the main heat transporting medium, and (2) a large bed of cenospheres with a simple integrated heat exchanger to extract more than 1 KW of heat from complete sub-rack assemblies of up to 40 printed circuit boards, for a fluidizing power of about 3 W. The effect of board spacing on the overall thermal performance is considered, and a minimum spacing of 10-20 mm is shown to be required to maintain cooling efficiency.
- Publication:
-
AIAA, 16th Thermophysics Conference
- Pub Date:
- June 1981
- Bibcode:
- 1981thph.confS....B
- Keywords:
-
- Cooling Systems;
- Electronic Equipment;
- Fluidized Bed Processors;
- Heat Transfer;
- Temperature Control;
- Aluminum Oxides;
- Energy Dissipation;
- Heat Exchangers;
- Particle Size Distribution;
- Pressure Gradients;
- Printed Circuits;
- Thermal Resistance;
- Electronics and Electrical Engineering