Reliability of silicon solar cells with a plated nickel-copper metallization system
Abstract
In order to achieve the goal of low cost photovoltaics, low cost processes that contribute to a long solar cell service life must be established. In this paper, the interactions between the silicon and the nickel contact are examined with respect to long term reliability. The effects of heat treatment of the contacts on diode performance are empirically examined by studying changes in electrical parameters of cells as a function of time and temperature. The results show that, utilizing the appropriate plating technique and establishing the appropriate assembly technique, a low cost, highly reliable nickel-copper metallization system can be used on silicon solar cells.
- Publication:
-
15th Photovoltaic Specialists Conference
- Pub Date:
- 1981
- Bibcode:
- 1981pvsp.conf..522G
- Keywords:
-
- Copper;
- Metallizing;
- Nickel Plate;
- Reliability Engineering;
- Solar Cells;
- Volt-Ampere Characteristics;
- Aging (Materials);
- Heat Treatment;
- Low Cost;
- Metal Surfaces;
- Service Life;
- Silicon;
- Solid-Solid Interfaces;
- Surface Reactions;
- Temperature Dependence;
- Time Dependence;
- Energy Production and Conversion