Boiling heat transfer of silicon integrated circuits chip mounted on a substrate

This paper describes a cooling technique employed for cooling substrate-mounted silicon chips during electrical tests. The chip and substrate assembly is immersed in dielectric FC86 liquid. Heat dissipation within the chip during the electrical test provides sufficient wall superheat so that boiling heat transfer occurs on the chip surface. Thermal tests to characterize the boiling process were run in an open bath of FC86 at various liquid temperatures ranging from 55 C to -25 C. Chip power and chip temperature were measured throughout the nucleate boiling region up to the critical heat flux. A correlation of the test data is obtained. Equations are proposed to estimate chip temperature and critical heat flux.