Thermal considerations in the packaging of electrical and electronic components
Abstract
The aims of electronic component thermal control are reviewed, taking into account the range of environmental conditions under which standard components may need to operate. The thermal characteristics of typical components are examined, taking into account semiconductor devices, multilayer/printed circuit boards, and high power microwave equipment. Aspects of thermal control technology are discussed, giving attention to heat transfer relations and thermal control options. The state of the art in circuit complexity is considered along with the thermal acceleration factor for bipolar digital devices, the governing specifications for some electronic components, immersion cooling of a klystron tube, a cooling arrangement for a traveling wave tube collector, and the active element for an RF antenna.
- Publication:
-
Heat Transfer in Electronic Equipment
- Pub Date:
- 1981
- Bibcode:
- 1981htee.proc....1B
- Keywords:
-
- Electronic Equipment;
- Electronic Packaging;
- Microwave Equipment;
- Power Conditioning;
- Temperature Control;
- Thermal Environments;
- Component Reliability;
- Electric Networks;
- Environmental Tests;
- Heat Transfer;
- Klystrons;
- Printed Circuits;
- Traveling Wave Tubes;
- Electronics and Electrical Engineering