High frequency semiconductor testing
Abstract
High-frequency hybrids were tested on fixtures that used stripline techniques for matching and interconnection. A number of problems with proper grounding were encountered, along with hybrid breakage that occurred when increased force was used to improve ground reliability. The approach used in this effort generally overcame these problems. An adapter scheme was developed that permitted testing a wide variety of hybrid physical configurations on a single tester.
- Publication:
-
Final Report Bendix Corp
- Pub Date:
- September 1981
- Bibcode:
- 1981bend.rept.....R
- Keywords:
-
- Electronic Equipment Tests;
- Printed Circuits;
- Quality Control;
- Semiconductor Devices;
- Adapters;
- Electronic Packaging;
- Ground State;
- High Frequencies;
- Reliability;
- Thermocouples;
- Electronics and Electrical Engineering