Quantitative adhesion data for two energetic physical vapor-deposition processes
Abstract
Quantitative ring shear adhesion data are provided for copper plated on titanium (Ti-6Al-4V) by the hot hollow cathode physical vapor deposition process and copper plated on 304 stainless steel by magnetron ion plating. Adhesion on difficult to plate substrates was quite good and compares favorably with data for electrodeposited coatings on similar substrates.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- December 1981
- Bibcode:
- 1981STIN...8317753B
- Keywords:
-
- Adhesion;
- Metal Coatings;
- Plating;
- Vapor Deposition;
- Copper;
- Hollow Cathodes;
- Hot Cathodes;
- Ion Plating;
- Metal Surfaces;
- Stainless Steels;
- Titanium;
- Engineering (General)