A viscometry system which studies reacting resin systems under predetermined temperature cycles is described. Constraints placed upon the design by the need to reduce the number of variables, and by the nature of the material under test, are discussed. The effect on a resin of a cure cycle which incorporates a dwell to allow temperatures to equalize throughout the laminate, was studied. By using fast exponentials as ramps, the systems can be used to study cure cycles in ovens and presses.
NASA STI/Recon Technical Report N
- Pub Date:
- November 1981
- Production Engineering;
- Resin Bonding;
- Heat Transfer;
- Instrumentation and Photography