Improved RF amplifier mounting scheme
Abstract
The use of a conductive, silicon rubber-based wafer is described in conjunction with RF amplifier module installation on double-sided printed wiring boards. The new method provides for device heat sinking, device pin stress relief, and low impedance device ultrahigh frequency (UHF) ground connection for achieving cost-effective reliable device performance.
- Publication:
-
IEEE Proceedings
- Pub Date:
- September 1980
- Bibcode:
- 1980IEEEP..68.1166D
- Keywords:
-
- Amplifier Design;
- Circuit Boards;
- Electronic Modules;
- Mounting;
- Ultrahigh Frequencies;
- Circuit Reliability;
- Cost Effectiveness;
- Electrical Impedance;
- Frequency Response;
- Wafers;
- Electronics and Electrical Engineering