Rectangular flat-pack lids under external pressure improved formulas for screening and design, revised
Abstract
Earlier work is improved and extended to provide formulas for the maximum tensile stress in the lid-to-wall seal, the maximum lid deflection, and the lid collapsing pressure for a rectangular flat-pack under external pressure. It is shown how these formulas can facilitate (a) the proper design of the package so that it will retain its hermeticity and serviceability under a given screening pressure and (b) the selection of a proper pressure to use in the hermeticity screening of an already designed package. Information is also given on the approximate equivalence of external pressure and centrifuge acceleration in regard to the seal stresses and lid behavior. Finally, experimental data on package hermeticity are presented which tend to confirm the validity of the main hypotheses of the present work.
- Publication:
-
Final Report Syracuse Univ
- Pub Date:
- June 1979
- Bibcode:
- 1979syra.rept.....L
- Keywords:
-
- Circuits;
- Electronic Packaging;
- Hermetic Seals;
- Numerical Analysis;
- Pressure;
- Stress Analysis;
- Tensile Stress;
- Electronics and Electrical Engineering