Prospects for integrated-circuit electronics in microwave applications
Abstract
The state of the art in microwave circuit integration is reviewed with the general conclusion that traditional IC fabrication methods involving combination of passive and active elements as hybrid devices lead to design solutions which do not allow full integration for microwave-range applications. Realistic prospects for microwave circuit integration hinge on successful development of circuits that employ wave processes in thin films and in thin-film layered structures. Some wave processes examined include acoustic waves in piezoelectrics, spin waves in ferromagnetics, carrier waves in semiconductors, and electromagnetic waves in segnetoelectrics.
- Publication:
-
Mikroelektronika
- Pub Date:
- February 1979
- Bibcode:
- 1979Mikro...8....3B
- Keywords:
-
- Hybrid Circuits;
- Integrated Circuits;
- Microwave Circuits;
- Network Analysis;
- Semiconducting Films;
- Electromagnetic Radiation;
- Ferromagnetic Films;
- Frequency Response;
- Gallium Arsenides;
- Piezoelectric Crystals;
- Thin Films;
- Electronics and Electrical Engineering