Reliability and failure mechanisms of electronic materials
Abstract
The paper presents a review of failure mechanisms for microelectronic materials within the framework of the so-called reliability physics. The topics discussed are thermal fatigue, interface reactions, metallization corrosion in silicon ICs, aluminum and gold metallization corrosion, mobile ions, dielectric failure, electromigration, and degradation of heterojunction lasers. Major future trends are mentioned, including the development of more economical interconnection and packaging techniques for ICs.
- Publication:
-
In: Annual review of materials science. Volume 8. (A79-14707 03-23) Palo Alto
- Pub Date:
- 1978
- Bibcode:
- 1978rms.....8..459E
- Keywords:
-
- Electrical Faults;
- Electronic Equipment;
- Failure Modes;
- Materials Science;
- Microelectronics;
- Reliability Analysis;
- Corrosion Prevention;
- Electronic Packaging;
- Integrated Circuits;
- Laser Materials;
- Metal Surfaces;
- Thermal Fatigue;
- Electronics and Electrical Engineering