Development report for high-reliability, low-cost integrated circuits
Abstract
Wafer fabrication has been completed. The control units(aluminum metallized DIC and DIP devices and trimetal devices in open DIC packages are 90-percent complete. Thermal-shock testing of HRLC(high-reliability, low-cost) product has defined a beam-tape design problem which has necessitated the redesign of the beam tapes on all types. Life-test matrices have been run on CD4012 and CA741 to gain a preliminary insight into the failure modes to be expected in Phase 3.
- Publication:
-
Technical Report
- Pub Date:
- September 1978
- Bibcode:
- 1978rca..reptR.....
- Keywords:
-
- Aluminum Coatings;
- Chips (Electronics);
- Integrated Circuits;
- Low Cost;
- Wafers;
- Circuit Reliability;
- Gold;
- Hermetic Seals;
- Platinum;
- Titanium;
- Electronics and Electrical Engineering