MLA reliability assurance - A continuing program
Abstract
A test program for determining the thermal fatigue life of multilayer assemblies (MLA) is described. Among the advantages of the test program are that the temperature cycling did not include thermal shocks, circuit continuity was monitored continuously, and temperature extremes were compatible for military electronic equipment. Complete MLA rather than multilayer boards were tested so that the effects of assembly operations would not be ignored. Tests of several MLA configurations are discussed.
- Publication:
-
Annual Reliability and Maintainability Symposium
- Pub Date:
- 1978
- Bibcode:
- 1978arm..symp..428P
- Keywords:
-
- Accelerated Life Tests;
- Avionics;
- Electronic Equipment Tests;
- Fatigue Tests;
- Laminates;
- Reliability Engineering;
- Thermal Cycling Tests;
- Fatigue Life;
- Sampling;
- Soldered Joints;
- Structural Failure;
- Thermal Expansion;
- Thermal Fatigue;
- Electronics and Electrical Engineering